NuVision Electronics (Pty) Ltd

Quectel HSM110XC BLE 5.4 SIP Module, with Internal PCB Antenna

Quectel HSM110XC is an ultra-compact, low-power Bluetooth Low Energy (BLE 5.4 SiP (System-in-Package) module designed for IoT and smart home applications.

Key Technical Specifications

  • Protocol: Bluetooth Low Energy (BLE) 5.4
  • Processor: ARM Cortex-M4 (up to 64 MHz)
  • Memory: 1 MB Flash memory and 80 KB SRAM
  • Dimensions: 6.0 x 6.0 x 0.9 mm (LGA package)
  • Operating Voltage: 1.71 V to 3.6 V
  • Operating Temperature: -40 ~ 85°C
  • Interfaces: Up to 25 GPIOs (multiplexed for UART, SPI, 12C, and ADC) via QuecOpen®
  • Antenna: Internal PCB antenna with optional external pin support
  • Security: AES-128, AES-256, and SHA-256 encryption support

Power Consumption

  • Broadcasting Current: ~10 µA (at a 1-second interval)
  • Connection Current: ~7 µA (at a 1-second interval)

Common Applications

  • Smart home systems
  • Industrial loT (IIoT)
  • Wearable devices and sensor networks
  • Beacon and asset tracking solutions
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